MKL02Z16VFM4

**The KL17 series is optimized for cost-sensitive and batterypowered

applications requiring low-power general-purpose connectivity. The product offers:**

• Embedded ROM with boot loader for flexible program upgrade
• High accuracy internal voltage and clock reference
• FlexIO to support any standard and customized serial peripheral emulation
• Down to 54uA/MHz in very low power run mode and 1.96uA in deep sleep mode (RAM + RTC retained)

Core Processor

• ARM® Cortex®-M0+ core up to 48 MHz

Memories

• 128/256 KB program flash memory
• 32 KB SRAM
• 16 KB ROM with build-in bootloader
• 32-byte backup register

System

• 4-channel asynchronous DMA controller
• Watchdog
• Low-leakage wakeup unit
• Two-pin Serial Wire Debug (SWD) programming and debug interface
• Micro Trace Buffer
• Bit manipulation engine
• Interrupt controller

Clocks

• 48MHz high accuracy (up to 0.5%) internal reference clock
• 8MHz/2MHz high accuracy (up to 3%) internal reference clock
• 1KHz reference clock active under all low-power modes (except VLLS0)
• 32–40KHz and 3–32MHz crystal oscillator

Peripherals

• One UART module supporting ISO7816, operating up to 1.5 Mbit/s
• Two low-power UART modules supporting asynchronous operation in low-power modes
• Two I2C modules and I2C0 supporting up to 1 Mbit/s
• Two 16-bit SPI modules supporting up to 24 Mbit/s
• One FlexIO module supporting emulation of additional UART, IrDA, SPI, I2C, I2S, PWM and other serial modules, etc.
• One serial audio interface I2S
• One 16-bit 818 ksps ADC module with high accuracy internal voltage reference (Vref) and up to 16 channels
• High-speed analog comparator containing a 6-bit DAC for programmable reference input
• One 12-bit DAC
• 1.2 V internal voltage reference

Timers

• One 6-channel Timer/PWM module
• Two 2-channel Timer/PWM modules
• One low-power timer
• Periodic interrupt timer
• Real time clock

Operating Characteristics

• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range: –40 to 85 °C for WLCSP package and –40 to 105 °C for other packages

Packages

• 64 LQFP 10mm x 10mm, 0.5mm pitch, 1.6mm thickness
• 64 MAPBGA 5mm x 5mm, 0.5mm pitch, 1.23mm thickness
• 48 QFN 7mm x 7mm, 0.5mm pitch, 0.65mm thickness
• 32 QFN 5mm x 5mm, 0.5mm pitch, 0.65mm thickness
• 36 WLCSP 2.8mm x 2.7mm, 0.4mm pitch, 0.6mm thickness

Security and Integrity

• 80-bit unique identification number per chip
• Advanced flash security

I/O

• Up to 54 general-purpose input/output pins (GPIO) and 6 high-drive pad

Low Power

• Down to 54uA/MHz in very low power run mode
• Down to 1.96uA in VLLS3 mode (RAM + RTC retained)
• Six flexible static modes